The Effect of Steam Aging Time and Temperature on Solderability Test Results
蒸汔老化时间和温度对可焊性测试结果的影响
High Solderability Tin alloy Electroplating Technology for Aluminum and Its Alloy
铝及铝合金电镀高可焊性锡基合金工艺
Review of tin and solderable tin alloy electroplating
电镀锡和可焊性锡合金发展概况
Developing Status of Solderable Sn Alloy Plating
电镀可焊性锡合金工艺的发展现状
The Friction Stir Welding Solderability of the High Strength Al Alloy Plate
高强铝合金厚板搅拌摩擦焊可焊性分
The use of fluxes with different activities affects the solderability and wetting balance of Pd coating.
不同活性助焊剂的使用也会影响钯镀层的焊锡性能。
Research into solderability of the film formed on copper surface with benzimidazoles
咪唑化合物在金属铜上形成表面膜的可焊性研究
Standard Practice for Determining Solderability of Thick Film Conductors
厚膜导体的软钎焊性测定
Factors Influencing the Solderability of Electro Less Nickel and Immersion Gold Layer
化学镀镍金层可焊性的影响因素
Excellent terminal strength and solderability due to structure of a metal plate terminal electrode.
优秀的终端强度和可焊性，由于结构的金属板端子电极。
A Study on Methylsulphonate Electroplating Process of Matt Pure Tin of Solderability
甲基磺酸电镀可焊性亚光纯锡工艺研究
Development of high speed electroplating additives of unleaded pure tin for pin solderability deposits
引脚可焊性镀层无铅纯锡高速电镀添加剂的开发
Solderability Evaluation of Thick and Thin Fused Coatings
厚, 薄热涂层的可焊性评估
Offers good solderability and excellent wettability.
具有良好的可焊性和优异的熔湿性。
Excellent in solderability and high heat resistance with either flow or reflow soklering.
可焊性和耐焊性优，适用于流焊和再流焊。
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