A model was proposed on the elastic deformation of silicon wafer contact in bonding.
提出了键合过程中硅片接触得一种弹性形变模型。

The method is to coat a wafer of silicon with a protective layer of silicon dioxide.
其方法是往硅片上涂上一层二氧化硅防护膜。

The structure and principle of the wafer picking and wafer expanding were discussed.
特别讨论了取片和扩晶动作得结构和原理。

Hundreds of systems are in use in wafer processing applications throughout the world.
成千上百种系统广泛应用于全球晶片工艺过程。

Study on Processing Technique of Silicon Wafer Back Surface of for External Gettering
外吸除用硅片背面加工技术的研究

Each diode is cut from a wafer of crystals layered over a base of silicon or sapphire.
每一个二极管都是从硅或者蓝宝石薄片上切割下来的。

A wafer production line is added, developing into a biscuit factory after World War II.
增加一条威化生产线，并在二战以后发展为饼干工厂。

Methods of optimization for throughput and cycle time in semiconductor wafer fabrication
半导体晶圆制造中产量与生产周期的优化方法

The surface grinding temperature of the silicon wafer ground by diamond wheels is studied.
研究金刚石砂轮磨削单晶硅片时的表面磨削温度。

How to Use the Thermal Saturation Method to Solve the Reflow Issue in Wafer Bumping Process
如何以热饱和效应克服晶圆凸块回焊制程的问题

The invention is capable of forming an even spread source coat on the surface of the wafer.
本发明能够在晶片表面形成均匀的扩散源涂层。

To make production plan according to customer requirement and Wafer Manufacturing capacity.
根据客户要求和无尘室能力安排生产计划。

In the latter case the pressure is raised and the wafer is mounted on the grounded electrode.
后者的压力升高硅片放置在接地的电极上。

There is a deflection angle between axis of friction rod and circular center of friction wafer.
并且摩擦棒轴心与摩擦片圆心有偏离角。

A laser beam is focused into an inorganic recording material applied on top of a silicone wafer.
一束激光聚焦到硅片上面的无机刻录材料内。

Haze A mass concentration of surface imperfections, often giving a hazy appearance to the wafer.
雾度晶圆片表面大量的缺陷，常常表现为晶圆片表面呈雾状。

The invention discloses a silicon wafer with perforating holes and a manufacturing method thereof.
本发明公开了一种具有穿导孔的硅晶片及其制造方法。

This paper introduces the technology of solid membrane transfer by wafer bonding and its applications.
阐述了利用键合方法转移薄膜材料得技术及其应用。

Talking flood control and tide over flood period for construction stage of water and wafer power project
谈水利水电工程施工期防洪度汛问题

The drilling machine for large glass wafer processing is a production machine for silicon pressure sensors.
大片玻璃打孔机是一台硅压力传感器的生产设备。

The tuning fork is fabricated from a single wafer of monocrystalline piezoelectric quartz by chemical etching.
这个音叉由单晶压电石英的化学腐蚀而伪造。

To provide a method and apparatus for heating fluid in the proximity head of a semiconductor wafer processing system.
提供了一种用于加热接近头中的流体的设备和方法。

Carrier Valence holes and conduction electrons that are capable of carrying a charge through a solid surface in a silicon wafer.
载流子晶圆片中用来传导电流的空穴或电子。

and a plurality of column holes are formed in the silicon wafer platform for leading the telescopic vacuum columns to penetrate through.
硅片台内设有若干柱孔，供可伸缩真空柱贯穿其中。

Design of Measurement and Control System for Variable Power Heating and Constant Temperature in Heteromorphic Wafer Cylinder Baking Machine
异形威化筒烘烤机变功率加热恒温测控系统的设计