Separation of the component lead from the solder fillet.
元件面或焊锡面的零件脚旁焊锡裂开。
If there were not, test lead of the biggest component on board.
若无上述的零件, 则量测板面最大零件的零件脚。
Preparation of Cupric Sulfate from Waste Electronic Component Lead
利用电子元件废引线制取硫酸铜
A Study on Safety Stock Management of Component Commonality Based on Lead Time.
基于提前期的通用件安全库存管理。
Green technology Manufactured with lead free and halogen free component packages.
绿色技术使用无铅和无卤素组件封装。
The microstructural anomalies resulting from cadmium embrittlement can lead to component fractures in service.
隔脆化造成的微结构异常会导致部件在使用中断裂。
A separating device separates the lead consonant component and the subsequent vowel component from each other.
提取装置提取出分离的后元音成分的第二特征
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