Solder that contains copper; melts at a relatively high temperature; used for brazing.
含铜的焊料，熔点较高，用于铜焊。

According to recognition of solder fog, can assist with determination of leadfree process.
透过锡雾状况辨别, 可辅助无铅制程之判定。

Effect of Solder Powder Character on Inducing Solder Ball in Course of Refluence Soldering
焊锡粉品质对回流焊时焊料球产生的影响

Manual solder equipment, hand Baptist tin heater Tool Grinder, hands and feet all aircraft.
手动焊锡设备，手浸锡炉，磨刀机，手推切脚机。

The solder wire should attain the standard provision deflection and pitch by straightening.
焊丝经校直应达到标准规定得挺度和翘距。

The extremely thin oxide coat will also hinder the solder wetting effect on metal surfaces.
而极薄的氧化层也将防碍金属表面上焊锡的润湿作用。

Preparation of new amorphous substitute for silver solder and investigation of its properties
非晶新型代银钎料的制备及性能研究

Single plated nickel barrier terminations has excellent solder heat resistance for soldering.
外部电极为镍的电镀构造，于焊接时具有极优越的耐热性。

The mechanics of making both the solder joint and the brazing joint are comparatively similar.
进行焊料连接和铜焊连接得方法比较相似。

In this case the solder pot has to be changed or coated and the solder bar has to be replaced.
在这种情况下, 必须更换或涂抹焊料槽, 并更换焊料棒。

Affects of Low Thermal Expansion Coefficient under fill on Reliability of Flip Chip Solder Joint
低膨胀系数底充胶对倒装焊焊点疲劳可靠性的影响

In surface mount assembly, the stencil is the gateway to accurate, repeatable solder paste deposition.
表面贴装, 钢网是锡膏正确重复印刷得要害。

Remove excess solder with small brush while plastic, leaving a fillet around end of valve as it cools.
焊料冷却后，将一条嵌条环绕在阀门的端口。

Very low leakage current, compact, easy to use power entry filter with fast on tabs or solder terminals.
低漏电流，小巧，端子嵌入或焊锡，方便安装和使用。

Slumping problem can be prevented during preheat. Solder short and capillary solder ball can be kept away.
预热阶段, 不会产生塌陷, 可大幅改善桥连, 微细锡珠等问题。

Experimental Study on the Deformation and Damage of Composite Adhesively Bonded Joints and Bimetal Solder Film
复合材料胶接及异材焊接界面形变与断裂的实验研究

Research on the Low Melting Point Solder Used With the Aluminium Foil Scraped and Rubbed for All Film Capacitors
全膜电容器低熔点刮擦焊料性能的研究

Finite element based solder joint fatigue life predictions for a same die stacked chip scale ball grid array package
芯片叠层球栅阵列尺寸封装的焊球疲劳寿命预测

The higher the temperature is , the bigger the stirring flow of the solder surface is, the more the scum there will be.
温度越高及焊锡表面的搅流越大, 形成的浮渣越多。

Solder Wick A band of wire removes molten solder away from a solder joining or a solder bridge or just for desoldering.
吸锡带用以去除焊点, 桥接, 或脱焊电熔融焊料的线带。

As an electric current passes through, the Joule heating and electromigration effects occur in the flip chip solder bumps.
当电流通过焊点时，会伴随产生焦耳热效应和电迁移效应。

Increase of Cu concentration will generate an increase in melting point of the alloy and increase of viscosity of the solder.
铜浓度增加会导致合金的熔点提高，焊料的粘性提高。

Solder Balling is recognized by numerous tiny solder balls trapped along the peripheral edge of the flux residue after reflow.
产品回焊后在残留的助焊剂周边会有大量小的锡球。

From this information the volume of solder paste required can be calculated, which can in turn be used to design the aperture dimensions.
由锡膏的用量, 可反过来用来设计孔的尺寸。

For removing dross through converting dross back to solder from solder pot or wave soldering machine， and greatly lower down the solder oxidization.
可用于锡炉和波峰焊中锡渣的还原，大幅降低锡的损耗。